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Thermal Modelling

Allows us the luxury of understanding thermal issues before committing to expensive tooling!
We can view hot spots see thermal mapping, air flow and transient time (time taken to reach saturation).

With this knowledge we can manipulate the design to give optimum heat transfer by heat-sinks, stirrer fans or component positioning, even down to PCB component level.

The efficient migration and extraction of heat increases product life and reliability.

Thermal simulation reduces development time plus the cost and embarrassment of a product thermal redesign.

Examples show:
  • Heat dissipation within a multi-carrier amplifier

    Maximum heat output was 950 watts. Main heat carriers, were 8mm thick copper plates clamped to an aluminium heat sink. External fans were required.

        
  • Enclosed IP54 GSM-R radio

    Radio designed for the rail industry to operate in ambient up to 70°C. Average power output 21.5 watts peeking to 35 watts for 5 minutes. Internal stirrer fans required, fans were internally switch on when internal temperature reached 55°C to increase fan life.